Application scenarios
Application scenarios
Application

Semiconductor and Controller Industry

It covers IGBT power module assembly, T‑PAK module assembly, and controller assembly and testing, achieving end-to-end process chain coverage—from power semiconductor module soldering and packaging to controller assembly and functional testing.

Semiconductor and Controller Industry

Engines and General Industry

Electric drive and traditional industries

Intelligent Control System

Welding industry

Controller Assembly and Testing Line

Controller Assembly and Testing Line

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T-PAK module assembly line

T-PAK module assembly line

The T-PAK module assembly line is specifically designed to meet the assembly requirements of power semiconductor modules in the T-PAK package format, further enhancing packaging precision and flexible changeover capabilities based on IGBT module assembly processes.

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IGBT module assembly line

IGBT module assembly line

The IGBT module assembly line is a high-precision, automated production line for semiconductor power modules, encompassing core processes such as module soldering, wave soldering, laser welding, and reflow soldering.

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