IGBT module assembly line

　　The IGBT module assembly line is a high-precision, automated production line for semiconductor power modules, encompassing core processes such as module soldering, wave soldering, laser welding, and reflow soldering. The line employs a three-axis modular tightening system and an automatic nail‑feeding mechanism (with a nail‑jamming rate as low as 0.2‰), complemented by line‑laser and CCD imaging inspection technologies to enable automated laser welding of copper tabs and automatic height measurement. In the adhesive‑coating process, a three‑axis modular dispensing unit is used, coupled with visual inspection of coating quality, ensuring consistent process performance across all modules. The entire process supports traceability of tightening and welding data, with quality information stored in real time and readily accessible at any moment.

　　 Core Process Flow

　　 Material loading, wave soldering, laser welding, module assembly welding, adhesive‑coating quality inspection, reflow soldering, data traceability, copper‑plate laser welding, housing adhesive application, bolt tightening

　　• Three-axis modular tightening system; X/Y or circumferential servo slide table ensures positioning accuracy.

　　• The nail‑feeding machine provides automatic feeding, with a nail‑jamming rate of only 0.2‰.

　　• Full-process data traceability, with real-time storage of quality information

　　• Dual inspection using a line laser and CCD imaging, with fully automated weld quality assessment.

　　• Three-axis module glue dispensing, with photo‑based inspection of glue‑application quality.