T-PAK module assembly line

　　The T‑PAK module assembly line is specifically designed to meet the assembly requirements of power semiconductor modules in the T‑PAK package format, further optimizing packaging precision and flexible changeover capabilities based on IGBT module assembly processes. The line supports recipe management, queue management, and changeover management, enabling rapid production switching among multiple module variants. Welding stations are equipped with welding pallets and high-speed chain conveyors, while dispensing stations feature dedicated dispensing pallets. Both the main line and the test line utilize independent pallet systems, ensuring precise interfacing between operations and efficient material flow. Standard workstations are fitted with assistive arms (with encoders), torque tools, plasma blowers, and static‑dissipative wrist straps, meeting semiconductor‑grade electrostatic discharge protection and cleanliness requirements.

　　 Core Process Flow

　　 Material loading, module positioning, laser welding, reflow soldering, bolt tightening, housing potting, safety compliance testing, recipe management, and changeover management.

　　• Formula management, queue management, and changeover management, supporting flexible multi‑product production.

　　•Independent pallet system: separate design for welded pallets, adhesive‑coated pallets, main‑line pallets, and test‑line pallets.

　　• Variable-speed chain conveyor, enabling efficient coordinated flow between the line and pallets.

　　• The nail‑feeding machine has a nail‑jamming rate of 0.2‰, and tightening data is fully traceable throughout the process.

　　• Standard workstation configuration: assistive arm (with encoder), plasma air blower, and electrostatic wrist strap, meeting semiconductor‑grade operating conditions.